Developed by Mitsubishi Electric Corp. and commercialized by Kyowa Electronic Instruments Co., Ltd. Embedded in resin, the KMP gage measures cure-shrinkage and internal strain. The compact design enables embedment in shaped resins and is suitable for internal stress measurement of products made by combining epoxy resin and metal. Model : KMP-8-H3-L100 Gage resistance :120?? Gage factor :Approx. 2.0 Length of sensing element :1 mm Apparent Young,s modulus :Approx. 70 GPa (Approx. 7000 kgf/mm 2 ) Operating temperature range :20 to 150??C Built-in thermocouple :K (?? 0.1 mm )